Printed circuit boards which are used in medical industry.
The manufacturing method of the multi-layer board is generally performed by the inner layer pattern, and then formed into a single-sided or double-sided substrate by printing etching, and is incorporated into a specified layer, and then heated, pressed and bonded, as for the subsequent drilling. The hole is the same as the plated through hole method of the double panel.
The equipment and processes required for multi-layer boards are more complex and high-end. When designing the size of multi-layer boards, it is often necessary to consider more factors, especially the size of the equipment, whether it can allow such large size.