SMT and DIP are both ways to integrate parts on the PCB. The main difference is that SMT does not need to drill holes on the PCB. In DIP, the PIN pin of the part needs to be inserted into the drilled hole.
SMT (Surface Mounted Technology)
Surface mounting technology mainly uses the mounting machine to mount some micro parts on the PCB board. Its production process is: PCB board positioning, printing solder paste, mounting machine placement, over-reflow oven and manufacturing inspection. With the development of technology, SMT can also mount some large-sized parts, for example, some larger-sized mechanical parts can be mounted on the motherboard.
SMT is very sensitive to the positioning and the size of the parts. In addition, the quality of solder paste and printing quality also play a key role.
DIP is "plug-in", that is, inserting a part on the PCB version. Because the size of the part is large and it is not suitable for mounting or the manufacturer's production process cannot use SMT technology, the part is integrated in the form of a plug-in. At present, there are two implementation methods in the industry: manual plug-in and robot plug-in. The main production processes are: adhesive backing (to prevent tin plating from undesirable places), plug-in, inspection, wave soldering, and plate printing (removed in the furnace Stains left in the process) and finished inspection.